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Mini DIP (SPM3) Application Note (2012-07-09)
Figure 1.2 Junction-to-case Thermal Resistance according to Current Rating of Mini DIP SPM Line-up
Noise Reduction
Small package and low power loss are the primary goals of low power modules. However, in recent
years, attempting to reduce power loss through excessively fast switching speed has given rise to various
challenges.
Excessive switching speed increases the dV/dt, di/dt, and recovery current and creates
challenges such as large EMI (Electromagnetic Interference), excessive surge voltage, and high magnitude
of motor leakage current. Such problems increase system cost and can even shorten motor life. Mini DIP
SPM series solve these problems by adjusting the switching dV/dt to around 3kV/ ? sec through advanced
gate drive impedance design.
Thanks to very low on-state voltage of the new generation IGBT and low forward voltage of FRD, an
optimized switching speed meeting the low EMI requirement has been realized in Mini DIP SPM while
keeping the total power loss at a low level equal to or less than other low power modules.
Cost-effective Current Detection
As sensor-less vector control and other increasingly sophisticated control methods are applied to
general industrial inverters and even in consumer appliance inverters, there is a growing need to measure
inverter phase current. Mini DIP SPM family has a 3-N terminal structure in which IGBT inverter bridge
emitter terminal is separated. In this type of structure, inverter phase current can be easily detected simply
by using external shunt resistance.
? 2008
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